2022年3月30日 · Two-Layer Rt-QFN, an advanced substrate technology, is based on the lead frame substrate technology. Unlike a lead frame that forms a substrate structure only by an etching process, Rt-QFN exhibits a premolding structure through a process of resin filling and grinding, thereby maintaining a higher degree of design freedom.

2022年4月29日 · 本文的目的是介绍两层 rt-qfn，一种基于引线框架的无芯基板。 （Rt-QFN 是 Haesung DS 的商标，表示预成型型引线框架基板。 ） 与引线框架相比，两层 Rt-QFN 可以确保更高的设计自由度，因此 I/O 引脚数覆盖范围介于引线之间框架和层压基板。

2022年4月29日 · CAE analysis showed that the thermal resistance of the two-layer Rt-QFN substrate was about 23% lower than that of the laminate substrate. The excellent heat dissipation property of two-layer...

QFN(Quad Flat Non-leaded package)をマップモールド成型(一括樹脂封止)する際に、リードフレームの裏面に貼り付ける樹脂漏れ防止用の接着テープです。 QFNマップモールド成形用テープ |半導体材料 | RESONAC

Two-Layer Rt-QFN, an advanced substrate technology, is based on the lead frame substrate technology. Unlike a lead frame that forms a substrate structure only by an etching process, Rt-QFN...

RT系列应用于QFN或SON的MAP封装形式。 封装前贴于引线框架背面，可防止塑封过程中形成毛刺，提高焊线良率。 该应用目前也扩展到其他封装形式。 使用热稳定性能高的热塑性粘结剂。 粘结剂的Tg、热稳定性高可提高焊线良率。 高Tg能防止封装时的毛刺产生。 胶带剥离后不会产生残胶。 室温环境下粘着性低，不易粘附灰尘。 *根据引线框架材质与环氧塑封料的种类的不同，可能需要加热。 *本文章中的数据是在力森诺科集团的实验条件下所测得的结果。 RESONAC力森 …

Regarding the structure of the QFN package, the Rt-QFN TM (which is a pre-molded lead-frame of Hasung DS [14]- [16]) structure with a wettable flank shape for improving solder wetting and the...

2023年9月25日 · 차세대 기판 구조인 Rt-QFN. 반도체 패키지 소형화 기술로 Multi row (~4 row), High In/Out (~400 pin) 구현 가능. Lead Frame 과 PKG Substrate 장점을 모두 가짐. 존재하지 않는 이미지입니다. Rt-QFN 기술을 이용한 제품 군들. - 리드프레임 제품 구조와 성형 방법 및 가공 방법에 따라. 존재하지 않는 이미지입니다. SLF (Stamped Lead Frame): 초정밀 금형을 타발하여 성형하는 방식, 주로 난이도가 낮거나 품질 신뢰성이 매우 중요한 제품 양산. 2019년 기준 세계 5위. …

Rt-QFN (Routable QFN) A QFN package with a pre-mold application, offering high-design flexibility; Enables precise pattern implementation and reduction of packaging processes

Resonac’s adhesive tapes are designed to prevent the leakage of resins attached to the backside of lead frames when map molding (batch resin sealing) quad flat non-leaded packages (QFN). Resonac has marketed these tapes for more than 20 years and holds a large global market share.