
品名:无铅sac305锡球 1.适用 此产品为ic 封装与主板植球制程专用之无铅bga 锡球。 2. 产品规格 (1)型号:icm-sac305-bga005~180 (2)合金成分:sn96.5/ag3.0/cu0.5 (3)尺寸:直径d=0.05~1.8mm,球形 (4)尺寸图示 (5)标准产品系列 产品名称 合金类型 型号 直径d
SAC305 Lead-Free Solder Alloy - AIM Solder
SAC305 Electropure is a high purity lead-free alloy containing 96.5% tin, 3% silver, and 0.5% copper. In solid solders, AIM’s Electropure proprietary manufacturing method reduces suspended oxides creating a low drossing, strong wetting alloy. SAC305 is widely used in hand, selective, wave and SMT soldering.
SAC305 alloy is a lead-free alloy suitable for use as a replacement for the Sn63Pb37 alloy. The replenishment alloys are sometimes used to stabilize and reduce the copper content in the
SAC305无铅锡膏详细参数说明 - 绿志岛—领先绿色科技
SAC305 系列无铅免清洗高可靠性锡膏,是为适应环保要求而研发的, 作为一款绿色产品,它满足欧盟的RoHS 及REACH 要求,同时其工艺 应用范围广泛。 特点. ① 助焊膏体系为无铅焊料(SnAgCu 体系)研制的,焊膏活性适中,润 湿性好;
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无铅焊料SAC305产品说明书
【用途】 云南锡业股份有限公司无铅焊料SAC3005适用于电子行业软钎焊、散热器及五金等各行业波峰焊、浸焊等精密焊接、特殊焊接工艺以及喷涂、镀锡等。 还可根据客户需求提供其他规格的产品。 【储 藏】通风、干燥、防潮,避免接触化学药品。 【保 质 期】见产品包装 【应用指导】/【注意事项】 1、锡渣产出率控制 无铅焊料在焊接温度下不断氧化产生锡渣,使锡锅中焊料流动性变差,出现连焊,虚焊,焊点强度不够等质量问题,锡渣的产生有多方面的原因,基本可采用以下几个方 …
SAC305 lead-free alloy contains 96.5 % tin, 3% silver, and 0.5% copper and is RoHS, REACH and JEIDA compliant. Applications include Wave, Selective, Hand and SMT Reflow Soldering. AIM ElectropureTM SAC305 bar solder offers reduced dross production and superior wetting and fluidity as compared to other solder brands.
SAC305, SAC387 and SAC405 are suitable for lead free wave soldering andselective soldering. A solder pot temperature of 255 to 265 °C (491 to 509 °F) is recommended for wave soldering application. If used for selective soldering, a solder pot temperature of 280 to 320 °C (536 to 608 °F) is recommended. N 2 environment (<1000ppm O
SAC305 is a widely used lead-free solder alloy made of tin (Sn), silver (Ag), and copper (Cu), with the composition of 96.5% tin, 3.0% silver, and 0.5% copper. The alloy was developed to comply with regulations such as RoHS (Restriction of Hazardous Substances), which restricts the use of lead in electronic products.
SAC305-锡 银 / 锡 银 铜 合 金 (SAC 合 金)-AIM Solder
SAC305 Electropure 是一种高纯度无铅合金,含有 96.5% 锡、3% 银和 0.5% 铜。在固体焊料中,AIM 的 Electropure 特殊的制造方法减少了氧化物,形成了一种锡渣少、润湿强的合金。
Alpha SAC305 Lead-Free Solder Bar | Cu/Ag/SN Solder Bar
Alpha SAC305 Lead-Free Bar Solder offers a reliable, RoHS-compliant solution for electronics and electrical soldering. This solder is ideal for high-reliability applications such as circuit board assembly and other lead-free manufacturing environments demanding strong, durable joints and RoHS compliance.
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