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SoCC '24: ACM Symposium on Cloud Computing Redmond WA USA November 20 - 22, 2024

System-on-Chip (SoC) and System-in-Package (SiP) devices, comprising digital, analog, optical, RF, and Micro-Electro-Mechanical Systems (MEMS) are foundations of ubiquitous embedded high-performance computing (HPC).

2024 IEEE 37th International System-on-Chip Conference. The 37th SOCC offers a three days technical program including keynote and plenary speeches, oral and poster presentations, hot-topic panel sessions, and one day of tutorials and industrial talks.

Read all the papers in 2023 IEEE 36th International System-on-Chip Conference (SOCC) | IEEE Conference | IEEE Xplore

2024年9月19日 · Published in: 2024 IEEE 37th International System-on-Chip Conference (SOCC) Date of Conference: 16-19 September 2024 Date Added to IEEE Xplore : 05 November 2024

System-on-Chip (SoC) and System-in-Package (SiP) devices, comprising digital, analog, optical, RF, and Micro-Electro-Mechanical Systems (MEMS) are foundations of ubiquitous embedded high-performance computing (HPC).

2024年5月6日 · For more than 36 years the IEEE International System-on-Chip Conference (SOCC) has been a premier forum for sharing latest advancements in SoC architectures, systems, logic and circuit design, process

2024年4月19日 · 本文解读了字节跳动基础架构编排调度团队发表在国际云计算顶级会议 SoCC 2023 上的论文“Gödel: Unified Large-Scale Resource Managment and Scheduling at Bytedance”。 论文链接: dl.acm.org/doi/proceedings/10.1145/3620678

2024年12月10日 · 近日，第15届 ACM云计算大会（SoCC，ACM Symposium on Cloud Computing）在美国西雅图微软全球总部召开。 上海交通大学电子信息与电气工程学院自动化系2021级博士研究生隋奕帆关于无服务计算的论文“Pre-Warming is Not Enough: Accelerating Serverless Inference With Opportunistic Pre-Loading”获评SoCC 2024会议最佳论文奖（Best Paper Award），论文通讯作者为自动化系李建勋教授。 这是自2010年首届 SoCC 举办以来， …