SICK Configuration & Diagnostic Software External device monitoring Enhanced function interface = safe SICK device communication Electro-sensitive protective equipment (e.g. C4000) Output signal switching device 1.6 Symbols used Recommendations are designed to give you some assistance in your decision-making

Operating Instructions Chapter 1 C4000 Select 8012247/YU76/2016-03-14 © SICK AG • Industrial Safety Systems • Germany • All rights reserved 7 Subject to change ...

SICK is one of the leading manufacturers of intelligent sensors and sensor solutions for industrial applica- tions. A unique range of products and services creates the perfect basis for controlling processes securely

SICK offers a wide range of safety light curtains, including the C4000 Standard, designed for various industrial applications to ensure safety and efficiency.

Description: Upgrades the C4000 Standard, Advanced, Palletizer, Entry/Exit, and Fu-sion to include the functions defined in the technical specifications, e.g., bypass, op-erating mode switching, and PSDI in the case of C4000 Standard, Advanced.

1 About this document. 1.1 Purpose of this document. Flexi Soft modular safety controller. Flexi Soft modular safety controller. Flexi Soft Modular

SICK is one of the leading manufacturers of intelligent sensors and sensor solutions for industrial applica-tions. A unique range of products and services creates the perfect basis for controlling processes securely and eficiently, protecting individuals from accidents and preventing damage to the environment.

These operating instructions contain information required during the life cycle of the safety light curtain. These operating instructions are available to all those who work with the safety light curtain.

初次退火通常用于形成钛硅合金层，但这可能首先形成c49相。 通过二次退火，可以促进从C49相向C54相的转变，从而降低材料的电阻率并提高其性能。 2.

2003年11月1日 · C49–C54 transition time versus the C49 formation time for a fixed temperature of 540 °C. Our observations indicate a greater stability of the C49 phase containing a high defect concentration and a strong dependence of the defect concentration on the particulars of the sample processing.