2025年3月18日 · 激光诱导深度蚀刻，英文名 Laser-Induced-Deep Etching，缩写LIDE。 LIDE工艺仅需两个步骤。 第一步，根据设计图形对加工玻璃进行选择性激光改性。 在LIDE工艺中，单次激光脉冲即足以产生对全厚度的改性效果，超高的效率适用于大批量的生产需求。 Step 2: 第二步，改性区域通过湿化学蚀刻法，其被蚀刻速度远远高于未被改性过的材料。 其特点是以前所未有的加工效率，经济可靠的制作径厚比大于1：10的结构。 最小可以加工小于5 μm的超微孔。 使 …

2023年9月14日 · Selective laser etching is a promising candidate for the mass production of glass interposers. It comprises two steps: local modification by an ultrashort-pulsed laser and chemical etching of the modified volume.

2024年2月25日 · This research focuses on the manufacturing of a glass interposer that has gone through glass via (TGV) connection holes. Glass has unique properties that make it suitable for 3D integrated circuit (IC) interposers, which include low permittivity, high transparency, and adjustable thermal expansion coefficient.

Glass substrates in advanced packaging are gaining momentum as their benefits are becoming more evident. Based on Yole report in 2020, it projected a 2.5~3 fold.

This paper reports the etching process of fused silica by inductively coupled plasmas (ICP) for through glass via (TGV) applications. Mixed C4F8 and Ar were used as etching gases in present...

2021年5月27日 · This paper reports selective etching process of borosilicate glass by laser-induced deep etching (LIDE) for through glass via (TGV) applications. Picosecond laser is used to modify the glass substrate, and then, with the help of the laser-induced selective etching (LISE), the modified glass samples are etched by hydrofluoric acid (HF) solution ...

2.5D glass interposer technology based on through glass via (TGV) becomes a hot research topic on account of good electrical property and CTE (coefficient of th

2016年10月1日 · We used mixed C 4 F 8 /He gases as the etching plasma to fabricate perforated structures on quartz and compare the process efficiency to show an excellent TGV morphology with smaller via diameter, thinner substrate, and better via shape for a vertical interposer.

laser-induced deep etching (LIDE) is a promising technology for efficient and cost-effective through glass via (TGV) manufacturing. In this paper, the effect of

TGV Etch 玻璃通孔（TGV）是一种先进三维集成电路技术，其可实现数据中心、5G通信网络和IoT设备等各种市场的设备小型化，以及高密度封装和GHz速度的数据处理。