
Thin small outline package - Wikipedia
Thin small outline package (TSOP) is a type of surface mount IC package. They are very low-profile (about 1mm) and have tight lead spacing (as low as 0.5mm). They are frequently used for RAM or Flash memory ICs due to their high pin count and small volume.
最全的芯片封装知识 - 知乎 - 知乎专栏
TSOP 是英文 Thin Small Outline Package 的缩写,即薄型小尺寸封装。 TSOP 内存封装技术的一个典型特征就是在封装芯片的周围做出引脚, TSOP 适合用 SMT 技术(表面安装技术)在 PCB(印制电路板)上安装布线。
从七种封装类型,看芯片封装发展史 - CSDN博客
2021年4月28日 · TSOP是英文“Thin Small Outline Package”的缩写,即薄型小尺寸封装。 TSOP内存封装技术的一个典型特征就是在封装芯片的周围做出引脚。
SOP、SSOP、TSOP、TSSOP、SOL、SOJ 封装的区别 - CSDN博客
2018年3月28日 · 在EIAJ 标准中,针脚间距为1.27mm (50mil)的此类封装被称为“SOP”。 请注意,JEDEC 标准中所称的“SOP”具有不同的宽度。 缩小外形封装,厚度正常,脚是密脚的。 薄小外形封装,薄体的脚,间距正常的。 薄的缩小外形封装,薄体的脚是密脚的。 按照JEDEC 标准对SOP 所采用的名称。 J 形引脚小外型封装。 芯片里的 有什么? 和 能否兼容?
SOP、DIP、PLCC、TQFP、PQFP、TSOP、BGA封装解释 - CSDN …
2016年6月29日 · TSOP是英文Thin Small Outline Package的缩写,即薄型小尺寸封装。 TSOP内存封装技术的一个典型特征就是在封装芯片的周围做出引脚,TSOP适合用SMT技术(表面安装技术)在PCB(印制电路板)上安装布线。
TSOP vs. BGA Chips - chipoffforensics
TSOP and BGA are packages that are commonly used to contain flash memory. TSOP (thin small outline package) NAND chips are “commonly found in thumb drives, SD cards, digital voice recorders, digital answering machines, and the iPhone 2 and 3G” and are “typically an easier type of memory chip to remove and read with chip-reading equipment” (Elder).
SOP、DIP、PLCC、TQFP、PQFP、TSOP、BGA封装解释
2016年6月29日 · TSOP是英文Thin Small Outline Package的缩写,即薄型小尺寸封装。 TSOP内存封装技术的一个典型特征就是在封装芯片的周围做出引脚,TSOP适合用SMT技术(表面安装技术)在PCB(印制电路板)上安装布线。
GitHub - jrabinowitz2/DIY-Flash-Reader-TSOP48: Homemade flash chip …
Instructions for building a homemade flash chip reader/programmer for TSOP48 packages. Chip-off connection via socket with attached breakout; arduino-based microcontroller uses bit-banging to read from or program chip via Serial Peripheral Interface (SPI). Other commands/manufacturers can be quickly implemented with slight modification...
TSOP types I and II packages (TSOP1; TSOP2) - JEDEC
Small-outline packages having gull-wing leads and whose thickness is substantially less than that of the standard SOG package. TSOP1 has the leads on the ends or short edges of the package while TSOP2 has the leads on the sides or long edges of the package. The lead pitch is often finer than that commonly used in the standard SOG package.
TSOP - Thin Small Outline Package
The Thin Small Outline Package, or TSOP, is a rectangular IC package with a thickness of 1.0 mm. There are two types of TSOP's. The Type I TSOP has its leads protruding from the shorter edges of the package. The Type II TSOP has its leads protruding from the longer edges of the package. TSOP lead counts range from 20 to 48.