Thin small outline package (TSOP) is a type of surface mount IC package. They are very low-profile (about 1mm) and have tight lead spacing (as low as 0.5mm). They are frequently used …

The Thin Shrink Small Outline Package (TSSOP) is a rectangular surface mount plastic integrated circuit (IC) package with gull-wing leads.

2024年1月5日 · Here we explained what IC packaging is and the different types of IC Packages like DIP, QFP, BGA, SOP, SMD, QFN, SOIC, and SOT.

Development of portable, lightweight, high-performance electronics products is driving the semiconductor industry toward smaller, thinner, and higher-density packages. Pricing …

Thin Small Outline Package (TSOP) is a rectangular IC package with a thickness of 1.0 mm. The lead counts range from 20 to 48. Thin SOP IC’s are packed in JEDEC trays or tape and reel …

The Thin Small Outline Package, or TSOP, is a rectangular IC package with a thickness of 1.0 mm. There are two types of TSOP's. The Type I TSOP has its leads protruding from the …

Small-outline packages having gull-wing leads and whose thickness is substantially less than that of the standard SOG package. TSOP1 has the leads on the ends or short edges of the …

Siliconware's Thin Small Outline Package type I with thin body thickness 1.0 mm is designed for a variety of applications where thin and small memory devices are required. A series of body …

ピンピッチが1.27mmのパッケージにおいて、JEITA規格のものは SOP 、JEDEC規格のものは SOIC (Small Outline Integrated Circuit) となります。 ピンピッチは同じですが、パッケージの …

Small Outline Package (SOP) is a gull wing (L-shaped) package with leads coming out of two sides of the package. The pin pitch of the Small Outline Package (SOP) is 50 mils (1.27mm). …