IPAK (TO-251) package, MOSFETs manufactured by Vishay, a global leader for semiconductors and passive electronic components.

Package Outline : TO-251 MIN NOM MAX A 2.10 2.30 2.50 A1 0.80 1.15 1.50 B1 0.40 0.70 1.00 B2 0.60 0.88 1.15 B3 0.50 0.83 1.15 c 0.30 0.50 0.70 c1 0.30 0.50 0.70 D 6.30 6.55 6.80 D1 4.80 5.20 5.60

2016年2月25日 · Package. Package Outline Share. Feb 25, 2016 | PDF | 107 kb. Package Marking Share. Feb 25, 2016 | PDF | 132 kb. Package LFO Share. Feb 25, 2016 | PDF | 12 kb

bility or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding . .2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please s.

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Package. PG-TO251-3-343_Package Outline Share. 01_00 | Nov 04, 2020 | PDF | 107 kb. Board Assembly Recommendations (TO) Share. 04_00 | Oct 11, 2021 | PDF | 1.91 mb. PG-TO251-3-343_Interactive 3D Share. 01_00 | Nov 04, 2020 | PDF | 192 kb. Board Assembly Recommendations (General) ...

The current marking strategy is reflected. Contact your local sales representative for historical marking strategies for these packages. THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000.

Package Outline Dimensions TO251 (Type HE1) TO251 (Type HE1) Dim Min Max Typ A 2.20 2.40 2.30 A2 0.97 1.17 1.07 b 0.68 0.90 0.78 b3 5.20 5.50 5.33 c 0.43 0.63 0.53 D 5.98 6.22 6.10 D1 5.30 REF e 2.286 BSC E 6.40 6.80 6.60 E1 4.63 5.03 4.83 H 10.00 11.44 11.22 k 0.40REF L 3.90 4.30 4.10 L1 ...

FETek Technology Corp. Data and specifications subject to change without notice. www.fetek.com.tw Ver : A 1 TO-251 Package Outline SYMBOLS

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