下载STC15W408AS-35I-TSSOP28中文资料、引脚图、Datasheet数据手册，有单片机 (MCU/MPU/SOC)详细引脚图及功能的应用电路图电压和使用方法及教程。

Package outline note TSSOP28 (SOT361-2) Limited warranty and liability — Information in this document is believed to be accurate and reliable.

2020年11月12日 · Body Length (mm) 9.7: Body Width (mm) 4.4: Min. Terminal Pitch (mm) Downloads. Package. Board Assembly Recommendations (Gullwing) Share 05_00 | Nov 12, 2020 | PDF | 2.03 mb

Package. PG-TSSOP-28-17_Package Outline Share. 09_00 | Aug 03, 2021 | PDF | 111 kb. Board Assembly Recommendations (Gullwing) Share 05_00 | Nov 12, 2020 | PDF | 2.03 mb

2019年4月30日 · a 28-Lead Thin Shrink Small Outline Package [TSSOP](RU-28) Dimensions shown in millimeters 9.80 9.70 9.60 28 1 5 4.50 4.40 4.30 1 1 46.40 BSC PIN 1 0.65 BSC 1.20 MAX 8° 0°0.75 0.60 0.45 0.15 0.05 COPLANARITY 0.10 0.30 0.19 SEATING PLANE 0.20 0.09 COMPLIANT TO JEDEC STANDARDS MO-153-AE 阅读了该文档的用户还阅读了这些文档 ...

28 LEAD THIN SHRINK SMALL OUTLINE PACKAGE (TSSOP) Rev 1, 5/10 DETAIL "X" TYPICAL RECOMMENDED LAND PATTERN TOP VIEW SIDE VIEW ... (TSSOP) Author: Renesas Subject: M28.173 Package Outline Drawing Keywords: M28.173, 28 Lead Thin Shrink Small Outline Package (TSSOP), TSSOP, POD, package outline drawing

28-TSSOP Package Outline Drawing4.4 mm Body 0.65mm PitchPGG28D1. PDF 202 KB: Jul 18, 2018: Certificate: Green Products RoHS Material Declaration Certificate. PDF 170 KB: Apr 30, 2018: End Of Life Notice: PDN# : K-09-16 PRODUCT DISCONTINUANCE NOTICE FOR SELECTIVE TPC PARTS. PDF 69 KB: Jan 5, 2010:

PGG28 (TSSOP 28) PGG28 (TSSOP 28) 跳转至页面部分： ; 文档标题 信息; Package Description. Descriptive text for this package. TSSOP 9.70x4.40x1.00 mm 0.65mm Pitch: Package Status. Active: Package Type.

Fairchild Semiconductor was a pioneering semiconductor company that was founded in the late 1950s. The company was known for its innovation in the development of the first commercial transistor and for its contributions to the advancement of the integrated circuit technology.

2025年3月11日 · Aries QFP and Small Outline (SO) Prototyping Adapters feature an Au flash pin plating, UL94V-0 rating, and a pin insulator with polyester construction. The QFP adapters mate common QFP packages to standard breadboard and breakout boards for rapid prototyping.