Abstract: New System-in-Package (SiP) with innovative Wafer-Level-System-Integration (WLSI) technologies that leverage foundry core competence on wafer processes have been …

In this way, a new concept for heterogeneous integration is currently being developed at CEA-LETI and is called system on wafer (SoW). This concept is based on a chip to wafer approach. …

A family of novel wafer-level-system-integration technologies (WLSI) was proposed. This paper reviews WLSI feasibility work first. Further results on the reliability, the compatibility of the …

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2024年2月14日 · WLP（Wafer Level Packaging）技术是一种直接在晶圆级别上进行封装的技术。 这种技术可以实现更高的生产效率和更小的封装尺寸，从而节省成本并提高性能。 在 2.5D封 …

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FOWLP, also referred to as advanced embedded Wafer Level Ball Grid Array (eWLB) technology, provides a versatile platform for the semiconductor industry’s technology evolution from single …

2009年2月1日 · Formation of TSVs and interconnection between chips and/or wafers are two key enabling technologies for 3D and 2.5D packaging, and different interconnection methods in …

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Wafer level packaging is where a die is packaged while still in wafer form, either singly or combined with additional dies or other components such as discrete passive devices, or …